Development of copper clad on pure titanium for an improved frictional characteristics and antibacterial properties

This study presents laser cladding of copper on commercially pure titanium surface for the first time with an aim to improve bio-mechanical and tribological performance. A thin layer of Cu metal was deposited onto cpTi substrate which offered superior control over intermixing clad with the substrate. The grain structures of the cladded region were in thermal equilibrium and exhibited cellular α-Cu refined phases at a scan velocity of 20 mm/s. The frictional coefficient of the clad metal was 25 % lower than cpTi substrate and Cu cladded CpTi metal exhibited killing rate of E.Colli cells 4 logs higher than the base metal. Moreover, the developed layer possessed a surface hardness as high as 485 Hv. The Cu cladding over bio-inert metal surface represents a promising surface engineering strategy to restrain health care associated infections more efficiently.

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成果名称:低表面能涂层

合作方式:技术开发

联 系 人:周老师

联系电话:13321314106

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成果名称:低表面能涂层

合作方式:技术开发

联 系 人:周老师

联系电话:13321314106

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成果名称:低表面能涂层

合作方式:技术开发

联 系 人:周老师

联系电话:13321314106

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成果名称:低表面能涂层

合作方式:技术开发

联 系 人:周老师

联系电话:13321314106

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