Amorphous hydrogenated carbon nitride (a-CN:H) films were deposited onto silicon (n-100) substrates by dual direct current radio frequency plasma enhanced chemical vapour deposition with CH4 and N-2 as feedstock at different ratios. The composition and surface morphology of the films were characterized by means of x-ray photoelectron spectroscopy, Raman spectroscopy and atomic force microscopy; while the mechanical and tribological properties of the films were evaluated using nano-indentation and the UMT test system. It was found that the deposition rate of the films decreased significantly but the N/C ratio, the surface roughness and the WIG ratio of the films increased as the N-2/CH4 flow ratio increased. The nano-hardness and adhesion strength of the films to the silicon substrate sharply increased at first and then decreased with increasing N-2/CH4 flow ratio. Moreover, the wear resistance of the films varied with the N-2/CH4 flow ratio. The structure transformation from an sp(3)-like to sp(2)-like carbon-nitrogen network in the deposited films was also revealed.