SiC/Cu composites modified by SiO2–Cu2O glass phase (GP) were prepared using sol-gel method and hot pressing sintering. The effect of GP on tribological, electrical and thermal properties of the samples were carefully investigated. It was found that the SiC/Cu composite with 5 vol% GP showed the high microhardness of 149 ± 2.3 HV, the lowest friction coefficient of 0.34 ± 0.02 and average wear rate of 1.12 × 10−5±0.09 mm3/(N·m), which is benefited from the solid-liquid sintering mechanism and solid-phase lubrication effect of GP. Moreover, the positive relationship was presented between thermal conductivity and temperature, which increases from 168.9 W/(mK) to 181.8 W/(mK) ranging from 25 °C to 400 °C. The electrical resistivity increases from 5.30 × 10−6 Ω cm to 10.11 × 10−6 Ω cm without obvious fluctuation ranging from 40 °C to 400 °C. This work provides a promising pathway to promote the application of SiC/Cu composite in the field of high temperature wear-resistant electronic materials.