Copper matrix composites are widely employed in electrical applications due to their high electrical and thermal conductivity. However, the inherent trade-off between electrical conductivity and mechanical/wear performance limits their broader structural use. In this study, Ni-coated HfC xN y-reinforced Cu matrix composites were synthesized with varying ceramic contents via ball milling and spark plasma sintering. The structural integrity, tensile behavior, electrical conductivity, and tribological performance of the composites were systematically investigated. SEM and XRD analyses confirmed uniform dispersion and stable incorporation of Ni@HfC xN y particles in the Cu matrix. Grain refinement was observed with increasing reinforcement, with the finest grain at 3   wt.%, accompanied by the highest tensile strength of 353 MPa-an 60% increase compared to pure Cu. Grain refinement was found to be the primary contributor to the enhanced yield strength. Friction and wear testing indicated a transition from adhesive to three-body abrasive and oxidative wear mechanisms. This work suggests potential applications of the designed composites in electrical contacts and friction components.